Revamping the Manufacturing Bill of Materials with the Power of Digital Twins

Authors: Ritesh Thakur

DOI: https://doi.org/10.37082/IJIRMPS.v13.i3.232443

Short DOI: https://doi.org/g9g7wh

Country: USA

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Abstract: This article examines the various challenges associated with Bill of Materials (BOM) complexity, which impacts several aspects of product design and manufacturing. One key reason for this complexity is the large number of components found in modern electronic devices. For example, a typical smartphone may contain over a thousand individual parts, each sourced from different suppliers. This diversity requires careful coordination and management to ensure that all components are compatible and available when needed. Furthermore, the rapid pace of technological advancement means that components are constantly being updated or replaced with newer versions. This ongoing change can lead to obsolescence issues, where certain parts become unavailable, forcing designers to quickly find suitable replacements
Another significant factor contributing to BOM complexity is the globalization of supply chains. Components are often sourced from multiple countries, each with its own regulatory requirements, lead times, and logistical challenges.
This article will delve into the concept of digital twins, a transformative technology that is reshaping the way we oversee bills of materials (BOM) and tackle the related challenges in managing them. Digital twins are virtual replicas of physical assets, processes, or systems, allowing for real-time monitoring, simulation, and analysis. By integrating data from various sources, digital twins enable organizations to gain deeper insights into their operations, enhance efficiency, and improve decision-making. This discussion will explore the ways in which digital twins can streamline BOM management, reduce errors, and promote proactive maintenance strategies, ultimately revolutionizing how businesses handle their materials and resources in this new digital era.

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Paper Id: 232443

Published On: 2025-05-02

Published In: Volume 13, Issue 3, May-June 2025

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